Recently, Huizhou C‑Flink Technology Co., Ltd. has completed its site relocation and upgrade, officially moving into Building B, 6th Floor, Jimei Industrial Park, No. 101 Jinfu Road, Xiaojinkou Subdistrict, Huicheng District, Huizhou City, marking a new milestone in the company’s development.

Following this move, C‑Flink has expanded its workforce to over 200 employees, including a dedicated R&D team of 20 members, and increased its production lines to 25. The factory covers a total area of 8,000 square meters and is equipped with a Class 100,000 cleanroom, establishing a standardized, large-scale modern manufacturing base. Leveraging the capacity advantages of the new facility, the company has successfully implemented a comprehensive domestic and international brand strategy, extending its business across five major global regions. Its products are exported to more than 30 overseas countries and regions, including Europe, the Americas, Australia, Southeast Asia, the Middle East, and the Asia-Pacific, while simultaneously strengthening both cross-border trade and direct domestic sales channels.

Since its establishment in 2017, C‑Flink has been deeply rooted in the research, development, and manufacturing of high-speed interconnect products. Drawing on 25 years of experience in developing communication cables and optical cable assemblies, the company focuses on DAC/ACC/AEC high-speed copper cables, active optical cables, and related modular products, providing AI computing data centers and supercomputing centers with one-stop high-speed interconnect solutions. At present, the company operates an integrated production and sales system under independent control, capable of handling ODM customization, OEM contract manufacturing, and comprehensive interconnect solution services. With fully automated production processes coupled with rigorous factory testing, it ensures stable and controllable product quality across all batches.

In the future, leveraging the capacity benefits of its new facility, C‑Flink will continue to advance the R&D and deployment of next-generation 1.6T products, expand its global market coverage, and deliver cost-effective high-speed interconnect products and supporting services to computing customers worldwide.