800G OSFP112 ACC

Product Overview

The 800G OSFP112 ACC is a high-performance cable assembly designed for high-speed data transmission scenarios. It strictly complies with the OSFP MSA, IEEE 802.3ck, and CMIS v5.0 protocol standards, delivering excellent high-speed transmission capabilities and stable operational performance. This product offers a variety of wire gauges ranging from 26 to 30 AWG, supporting transmission distances of up to 5 meters, thus meeting diverse cabling requirements across different deployment environments. It supports two high-speed transmission rates—8x112G NDR and 8x56G HDR—and features hot-swappable functionality, low-power design, and EMI resistance. Additionally, it provides two structural options—Finned top and Flat top—with an operating temperature range of 0°C to 70°C, making it an ideal high-speed connectivity solution for data centers, cloud servers, and other similar applications.

Core Protocols and Technical Standards

As a professional high-speed cable assembly, the 800G OSFP112 ACC is fully compatible with industry-leading protocol standards, ensuring seamless interconnection and stable transmission between devices. It conforms to the OSFP MSA specification, an open system interconnect packaging protocol developed by the Optical Internetworking Forum, guaranteeing compatibility with OSFP devices from various manufacturers. It also adheres to the IEEE 802.3ck standard, which defines high-speed physical layer specifications for Ethernet, providing technical support for 800G-level data transmission. Furthermore, it is compatible with the CMIS v5.0 protocol, the industry standard for optical module management interfaces, enabling precise monitoring and management of the cable assembly to ensure reliable operation of the transmission link.

Transmission Performance and Specification Parameters

1. Wire Gauge Options: Offers a range of wire gauges from 26 to 30 AWG, allowing users to balance transmission distance and wiring flexibility to meet spatial and transmission needs in different scenarios.
2. Maximum Transmission Distance: Supports up to 5 meters, maintaining stable high-speed transmission within this range, suitable for short-distance high-speed connections between racks and devices in data centers.
3. Supported Transmission Rates: Compatible with both 8x112G NDR and 8x56G HDR modes. The NDR mode achieves a total transmission bandwidth of 800G, while the HDR mode caters to 400G bandwidth requirements, satisfying the transmission needs of equipment from different generations.
4. Operating Temperature Range: 0°C to 70°C, adaptable to typical operating temperatures in data center facilities, ensuring stable transmission performance even under temperature fluctuations.
5. Power Consumption: With a maximum power consumption of only 1.5W per end, its low-power design effectively reduces overall device energy usage, lowering electricity costs and thermal management burdens in data centers.

Key Features and Design Advantages

1. Hot-Swappable Functionality: Supports hot-swapping, allowing cable connection and disconnection without shutting down equipment, facilitating maintenance, upgrades, and capacity expansion, reducing system downtime, and improving data center operational efficiency.
2. EMI Resistance Design: Equipped with specialized EMI-resistant design, effectively suppressing electromagnetic interference signals and preventing external electromagnetic environments from affecting high-speed transmission links, thereby ensuring data transmission accuracy and stability, particularly suited for densely packed, electromagnetically complex data center environments.
3. Dual Structural Options: Provides Finned top and Flat top designs. The Finned top structure offers superior heat dissipation, ideal for high-load operating environments, while the Flat top structure features a more compact appearance, suitable for space-constrained cabling settings. Users can choose flexibly based on actual needs.
4. Low-Power Operation: With a maximum power consumption of just 1.5W per end, it consumes less energy than comparable high-speed cable assemblies, reducing both device power usage and cooling demands, thus enhancing data center energy efficiency and aligning with the trend toward green data centers.

Core Product Value

1. Multi-protocol compatibility ensures seamless interconnection with devices from different manufacturers, reducing compatibility risks during deployment and improving system setup efficiency.
2. Dual high-speed rate support accommodates both 400G and 800G bandwidth requirements, meeting the upgrade transition needs of data centers from HDR to NDR, extending product lifecycle.
3. Low-power design effectively reduces overall data center energy consumption, cutting operating costs and aligning with the industry’s green and energy-saving development direction.
4. Flexible wire gauge and structural options adapt to diverse cabling and equipment needs, enhancing deployment flexibility and suitability.

Target Customer Groups

Data center operators, cloud service providers, switch and router manufacturers, data storage system integrators, communication industry solution vendors, and enterprise IT infrastructure construction service providers.

Application Scenarios

This product is primarily used in high-speed data transmission-related scenarios, with key application areas including: connecting 800G Ethernet devices to build high-bandwidth Ethernet transmission links; enabling high-speed interconnections among switches and routers to enhance data forwarding capabilities at core network nodes; facilitating internal connections within data storage systems for high-speed data exchange between storage devices; establishing stable and efficient high-speed data transmission networks between racks, servers, and network equipment inside data centers; and interconnecting cloud server clusters to ensure high-speed data processing and transmission capabilities for cloud services.

Solving Industry Pain Points

1. Addressing poor compatibility issues of traditional high-speed cables: By supporting multiple protocols such as OSFP MSA and IEEE 802.3ck, it ensures seamless interconnection with devices from various brands, avoiding system setup obstacles caused by compatibility problems.
2. Mitigating interference during high-speed transmission: Its specialized EMI-resistant design effectively counters electromagnetic interference, resolving the pain point of frequent errors in high-speed transmission within complex electromagnetic environments of data centers, thus ensuring stable data transmission.
3. Reducing energy consumption pressure in data centers: The low-power design significantly cuts the power consumption of cable assemblies, complementing data center energy-saving strategies to lower overall operating costs and solve the industry challenge of excessive energy use in high-bandwidth scenarios.
4. Adapting to diverse cabling needs: Offering multiple wire gauges and two structural options addresses the limitation of single-specification cables failing to meet varying spatial and transmission requirements, enhancing deployment flexibility and convenience.

Frequently Asked Questions (FAQ)

Q1: What is the maximum transmission distance supported by the 800G OSFP112 ACC?
A: This product offers a range of wire gauges from 26 to 30 AWG, supporting transmission distances of up to 5 meters, where it can stably maintain either 8x112G NDR or 8x56G HDR high-speed transmission rates.
Q2: Does this cable assembly support hot-swapping?
A: Yes, the 800G OSFP112 ACC supports hot-swapping, allowing cable connection and disconnection without shutting down equipment, facilitating maintenance and capacity expansion.
Q3: What is the product’s operating temperature range?
A: The operating temperature range is 0°C to 70°C, adaptable to typical data center operating conditions, ensuring stable transmission performance within temperature fluctuations.
Q4: How many structural options are available for the 800G OSFP112 ACC?
A: The product offers two structural options—Finned top and Flat top. The Finned top structure provides superior heat dissipation, while the Flat top structure has a more compact appearance. Users can select based on their specific deployment needs.